Standard Configuration

va-Q-pro

In addition to an outstanding thermal conductivity of 0.0035 W/mK, the va-Q-pro features two- and three dimensional free forms of Vacuum Insulation Panels (VIPs). In combination with the automated   manufacturing process, these free forms are unique on the market. The va-Q-pro technology has enormous flexibility when it comes to panel design, with a multitude of variations available including circular shapes, angled 3D formats, folding boxes, cut-outs, and passthroughs. When combined with conventional rectangular VIPs, such as va-Q-plus, these technologies can provide energy-efficient high-performance insulation even where application circum-stances are complex. Specific examples include the insulation of vehicles, aircraft, refrigeration units, machinery systems, thermal boxes, and hot water tanks.

In addition to an outstanding thermal conductivity of 0.0035 W/mK, the va-Q-pro features two- and three dimensional free forms of Vacuum Insulation Panels (VIPs). In combination with the automated   manufacturing process, these free forms are unique on the market. The va-Q-pro technology has enormous flexibility when it comes to panel design, with a multitude of variations available including circular shapes, angled 3D formats, folding boxes, cut-outs, and passthroughs. When combined with conventional rectangular VIPs, such as va-Q-plus, these technologies can provide energy-efficient high-performance insulation even where application circum-stances are complex. Specific examples include the insulation of vehicles, aircraft, refrigeration units, machinery systems, thermal boxes, and hot water tanks.

Advantages of va-Q-pro

Achieving the highest energy efficiency classes by reducing energy losses
Maximization of VIP surface coverage through customized design
Exceptional insulation performance due to thermal conductivity (10 °C) of ≤ 0.0035 W/mK
Without any product or process changes on the part of the client
Customized development of tailor-made solutions through holistic consulting (simulations, test center, etc.)

Technical Data

Thermal Conductvity @10°C
[W/(m*K)]
< 0.0035
Thermal Conductvity @10°CDensityMinimum Dimensions (l x w)Maximum Dimensions (l x w)Thickness
[W/(m*K)][kg/m³][mm][mm][mm]
< 0.0035160 - 230100 x 1001800 x 10204 - 16